JPH0432531U - - Google Patents
Info
- Publication number
- JPH0432531U JPH0432531U JP1990073550U JP7355090U JPH0432531U JP H0432531 U JPH0432531 U JP H0432531U JP 1990073550 U JP1990073550 U JP 1990073550U JP 7355090 U JP7355090 U JP 7355090U JP H0432531 U JPH0432531 U JP H0432531U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- copper foil
- hole
- bump electrode
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990073550U JPH0432531U (en]) | 1990-07-10 | 1990-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990073550U JPH0432531U (en]) | 1990-07-10 | 1990-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0432531U true JPH0432531U (en]) | 1992-03-17 |
Family
ID=31612462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990073550U Pending JPH0432531U (en]) | 1990-07-10 | 1990-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432531U (en]) |
-
1990
- 1990-07-10 JP JP1990073550U patent/JPH0432531U/ja active Pending